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Semicon Shanghai 2012
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Find out our newest developments in MEMS production.
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Electroplating plant for plating of metallic microstructures
• Designed for the use in cleanrooms, the shell is made of Polypropylen (natural)
• Suitable for separating application in the field of microtechnology and semiconductors
• Modular structure, standard: one process cell with one wash cell, extension to build up process lines is possible
• Additional process cells could be integrated, made of Polypropylen (natural)
• Waferdiameters from 4” to 8” are processable in one process cell, other dimensions possible (by using other process cells)
• Different process cells like Rack Plater, Cup Plater or Jet Plater are possible
• Separation of metalls (Au Ni, Cu, ..) and alloys (Ni-Fe, Ni-Co, …)
• The electroplating process runs automatically, all process parameters like pH, Temperature, flow rate,… are controlled.
• Integrated system to pull out the used air
• Rinsing cell or Quick Dump Rinser
• Automation for handling single wafers possible
• Customized solutions are possible
• Control of the system by using an Operator Panel
Simulation (Elsyca NV Belgium) 3D MID application
