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Electroplating Tool µGalv

• Suitable for deposition application in the field of microtechnology and semiconductors including TSV fill, RDL,

Pads, Contacts, Pillars, etc.

• Designed for the use in cleanrooms, the shell is made of Polypropylen (natural)

• Modular structure, standard: one process cell with one wash cell, extension to build up process lines is possible
• Additional process cells could be integrated, made of Polypropylen (natural)
• Different Waferdiameters are processable in one process cell,  up to 12"

• Different process cells like Rack Plater, Cup Plater or Jet Plater are available

 

• Electroplating of Au (Pads or Contacts, cyanide or cyanide-free), Ni, Cu (Redistribution Layer RDL, Pillar, TSV fill), Indium, Sn and Sn-alloys (like SnPb, SnAg), NiFe, NiCo, NiW, SnPb...

• Electro less plating of Ni, Cu, Au, NiP, SnPb,…

• The electroplating process runs automatically, all process parameters like pH, Temperature, flow rate,… are controlled.

• Rinsing cell or Quick Dump Rinser
• Automation for handling single wafers possible, Customized solutions are possible
• Control of the system by using a Touch Panel