Electroplating Tool µGalv
• Suitable for deposition application in the field of microtechnology and semiconductors including TSV fill, RDL,
Pads, Contacts, Pillars, etc.
• Designed for the use in cleanrooms, the shell is made of Polypropylen (natural)
• Modular structure, standard: one process cell with one wash cell, extension to build up process lines is possible
• Additional process cells could be integrated, made of Polypropylen (natural)
• Different Waferdiameters are processable in one process cell, up to 12"
• Different process cells like Rack Plater, Cup Plater or Jet Plater are available
• Electroplating of Au (Pads or Contacts, cyanide or cyanide-free), Ni, Cu (Redistribution Layer RDL, Pillar, TSV fill), Indium, Sn and Sn-alloys (like SnPb, SnAg), NiFe, NiCo, NiW, SnPb...
• Electro less plating of Ni, Cu, Au, NiP, SnPb,…
• The electroplating process runs automatically, all process parameters like pH, Temperature, flow rate,… are controlled.
• Rinsing cell or Quick Dump Rinser
• Automation for handling single wafers possible, Customized solutions are possible
• Control of the system by using a Touch Panel
