- Short Break at the turn of the Year more »
- Season Greatings and a Happy New Year 2020 more »
- Semicon Shanghai 2019 past more »
- Semi Show Shanghai 2019 more »
- Season Greatings and a Happy New Year more »
- Semicon Taiwan 2018 past more »
- Stellenangebot - Job Offer more »
- Semicon 2018 Taiwan, Booth L926 more »
- Semicon Shanghai 2018 past more »
- Semi Show Shanghai 2018 more »
- Cu Seed Process and TSV Fill Process: more »
Cost-effective wet processes for MEMS and Semiconductor production
Drawing on a 25 year history in the design and supply of wet chemical processes, MOT is a highly experienced, committed partner for commercial and R&D manufacturers.
Our custom-made wet process based solutions help manufacturers to reduce costs even further. The systems are designed is for both, laboratory and high-volume production. The developed process cells are suitable for the manufacture of Ni, Cu, Au, In, NiFe, and other multi layer systems for different applications like TSV, RDL, Pillar, etc.
