• Semi Show Shanghai 2018 more »
  • News

    Cu Seed Process:
    MOT is able to supply turn-key step for wet chemical Cu-seed in the range of up to 200nm thickness, contact us for further information.

     

    TSV Fill Process:

    MOT is able to supply turn-key step for Cu-fill in TSV application, contact us for further information.

     

    Semi Show:

    During the Semicon in Shanghai we have been able to establish new contacts and to maintain existing. Many thanks to all visitors to our booth and looking forward for Semicon Shanghai 2018.

    more »