Process Chemicals
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Process Chemicals
Beside the plating equipment, MOT is able to supply specific designed plating solutions for reliable processing. In detail, we can offer:
- micro plate Ni, a sulphamic Nickel electrolyte
- micro plate Cu, an acidic Copper electrolyte
- micro plate NiFe, a reliable electrolyte for the deposition of Permalloy or other Ni-Fe alloy ratios up to 55% Iron content
- micro plate NiP, for the electrodeposition of Nickel-Phosphoer layers
For other plating solutions like NiW, Sn or other metals or alloys please feel free to contact us.
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Talk to us
Contact us to take the next step in SEMICON and MEMS-Nano production.