TSV Fill Process:
MOT is able to supply turn-key step for Cu-fill in TSV application, contact us for further information.
During the Semicon in Shanghai we have been able to establish new contacts and to maintain existing. Many thanks to all visitors to our booth and looking forward for Semicon Shanghai 2018.more »
Cost-effective wet processes for MEMS and Semiconductor production
Drawing on a 25 year history in the design and supply of wet chemical processes, MOT is a highly experienced, committed partner for commercial and R&D manufacturers.
Our custom-made wet process based solutions help manufacturers to reduce costs even further. The systems are designed is for both, laboratory and high-volume production. The developed process cells are suitable for the manufacture of Ni, Cu, Au, In, NiFe, and other multi layer systems for different applications like TSV, RDL, Pillar, etc.
Contact us to take the next step in SEMICON and MEMS-Nano production.